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A high-performance thermal paste designed for exceptional long-term stability and superior thermal conductivity. Its formulation is based on a specialized silicone oil combined with aluminum microparticles and zinc oxide nanoparticles.
The optimized shape and size of the particles minimize the "pump-out effect," ensuring strong adhesion to surfaces and very low thermal resistance. This allows the paste to be applied in a very thin layer for efficient heat transfer between a component (like a CPU) and its cooler.
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